Capabilities Specifications

Substrates

STANDARD	96% Alumina	Thickness: 1 mm, 0.635 mm
POWER	Aluminium Nitride Direct-bonded copper ceramic	20 x thermal conductivity Increased current density
Max Print size	150 mm x 100 mm

Printing

Conductors

Wire Bondable	Gold	4-7 mΩ/Square
Solderable	Palladium-Silver	20-30 mΩ/Square
Solderable Over Gold	Platinum-Gold	50-60 mΩ/Square
Standard Track/Gap	0.010" ++width, 0.010" spacing
Minimum Track/Gap	0.002" width, 0.001" spacing
Conductor Layers	6 Each Side
Through-Printed Holes	Gold	<20 mΩ Thru-hole
(Double Sided Printing)	Palladium, Silver	<50 mΩ Thru-hole

Resistors

Range	<1 Ω To >50 MΩ
<10 Ω	+/-0.5 Ω
10 Ω To 100 Ω	+/-0.5%
100 Ω To 300 KΩ	+/-0.3%
> 300 KΩ	+/-0.5%
Stability	100 Ω to 1 MΩ	+/-0.5%
Absolute TCR Standard	+/- 100 ppm/°C
Absolute TCR Special	+/- 50 ppm/°C
Matching	Mid-Range Values	+/-0.1%
Power Dissipation	50 Watts/Square-Inch Nominal
Adjust On Test Facility	Active trim of circuit function (R or C)
Close Tolerance Resistors	Thin film chip resistors to 0.02% Absolute, 0.01% Matching

Assembly

CHIP AND WIRE	Transistors, FETs, Diodes Digital and analogue ICs Microprocessors and Memory Thin Film Resistors Inductors, Transformers, Crystals Capacitors, Ceramic, Tantalum or MOS
SOLDER SURFACE-MOUNT	All the above mounted as small-outline plastic packs, LCC or PLCC, D-packs (Power Devices) Chip Resistors

Wire Bonding

Gold	Thermosonic	0.0007" to 0.002" diameter
Aluminium	Ultrasonic	0.0007" to 0.002" diameter
Power Aluminium	Ultrasonic	0.005" to 0.025" diameter

Packages

Mil Spec Chip & Wire	Seam-sealed metal packs Epoxy-sealed ceramic packs
Mil/Industrial	Silicone bond protected, Epoxy coated
Industrial & Commercial	Epoxy Coated
Surface-Mount	Epoxy Coated
Format	Dual-In-Line Single-In-Line Double Sided, Mixed Build Customised Format (To suit application)

Electrical Test

Prototype Testing	Manual test or ATE
Production Testing	Bespoke PC controlled ATE system driving crates of dedicated equipment and IEEE controlled test equipment
Functional & Parametric testing at +22°C	To customers specifications
Hot & Cold Testing	T max and T min as specified, sample or 100%

Environmental Test

100% Group A screening tests

Fine & Gross Leak	<5 x 10⟩8 ATT CC/S
Acceleration (steady state)	5000 G
Rapid change of temperature	-65 °C To +150 °C, 5 Cycles
Burn-in	160 Hours at +125 °C, Powered

• Group B screening tests - sample, monthly
• Group C screening tests - sample, quarterly
• Group D screening tests - sample, yearly