Formed in 1986 as a specialist thick-film hybrid design and fabrication facility, the Portchester operation offers a wide range of proven production techniques and processes in the microelectronics and allied fields, supported by an innovative design team.
- Hybrid design
- Thick film hybrids
- Power electronics
- Sensor electronics
- Microwave electronics
- Chip on board
- Mixed technology hybrids
- Opto-electronics
- Sub-assembly
- Electronic design
- Software design
- Product miniaturisation
With clients spread over aerospace, defence, oil and gas, medical, communications and scientific instrumentation industry sectors, for both design and fabrication contracts, the accumulated expertise and range of capabilities place the Portchester facility amongst the leaders in the field of microelectronics.
Hybrid technical information
| Substrate |
|---|
| Standard | 96% Alumina |
| Power applications | Alumina nitride |
| Maximum substrate size | 150 x 100mm |
| Conductors |
|---|
| Wire bondable | Gold | 4 - 7 mohms / square |
| Solderable | Palladium - silver | 20 - 30 mohms / square |
| Solderable over gold | Platinum - gold | 50 - 60 mohms / square |
| Standard track/gap | 0.025mm width, 0.025mm gap | |
| Conductor layers | 6 each side | |
| Through-printed holes | Gold | <20 mohms thru-hole |
| Double-sided printing | Palladium, silver | <50 mohms thru-hole |
| Resistors |
|---|
| Range | <1 ohm to >50 mohms | |
| | <10 ohms | +/ - 0.5 ohms |
| | 10 to 100 ohms | +/ - 0.5% |
| | 100 ohms to 300 kohms | +/ - 0.3% |
| | >300 kohms | +/ - 0.5% |
| Stability | 100 ohms to 1 mohm | +/ - 0.5% |
| Absolute TCR standard | +/ - 100ppm/°C | |
| Absolute TCR special | +/ - 50ppm/° C | |
| Matching | Mid-range values | +/ - 0.1% |
| Power dissipation | 77.5 kwatts/metre2 nominal | |
| Adjust on test facility | Active trim of circuit function (R or C) | |
| Close tolerance resistors | Thin film chip resistors | |
| Wire bonding |
|---|
| Gold | Thermosonic, 0.0177mm to 0.05mm Ø. |
| Aluminium | Ultrasonic, 0.0177mm to 0.05mm Ø. |
| Aluminium power | Ultrasonic, 0.127mm to 0.635mm Ø. |
| Add-on components |
|---|
| Chip and wire transistors, FETS, Diodes. | Digital and analogues IC's. |
| | Microprocessors and memory |
| | Thin film resistors |
| | Inductors, transformers, crystals. |
| | Capacitors, ceramic, tantalum or MOS. |
| Solder Surface Mount | All the above mounted as small outline plastic packs, LCC or PLCC, D-Packs (Power Devices) |
| | Chip resistors. |
| Packages |
|---|
| Mil spec chip and wire | Seam-sealed metal packs |
| MIL spec chip and wire | Epoxy-sealed ceramic packs |
| Industrial spec chip and wire | Silicone bond protected, epoxy coated |
| Industrial and commercial | Epoxy coated |
| Surface mounted | Epoxy coated |
| Format | Dual-in-line |
| | Single-in-line |
| | Double-sided, mixed build customised format to suit the application. |
| Group A screening tests |
|---|
| Fine/gross leak | < 5 x 10-8 att cc/s |
| Acceleration (steady state) | 5000g |
| Rapid change of temperature | -65°C to +150°C, 5 cycles |
| Burn-in | 160 hours at +125°C, powered |
| Functional tests at 25°C | To customers specification |
| Temperature tests (sample) | T max and min as required |
| Special features |
|---|
| Pin grid array hybrids | Customised packaging |
| Double-sided hybrids | Print through or clip round |
| Resistors on dielectric | Allows tracking under resistors |
| Fine line and space | 0.1mm line and space (conventional printing) |
| | 0.05mm line, 0.025mm space (new method, patent applied for) |
| Glass windows in metal or ceramic | Mounting on photo-devices or eprom. |
| Militarised ceramic hybrids | Using solder metal frame lids |
| High temperature hybrids | Up to 200°C. |
| Power hybrids | High dissipating devices |
